Fig. 2
From: Solderjet bumping packaging technique optimization for the miniaturization of laser devices
Different simulated geometries as seen on Table 1, designed using ANSYS 17.0 Design Modeler. In a 300 μm side cube soldered to a base plate using two soldering bumps alloy of 300 μm diameter, with one bump at each sides. In b a 1 mm cube soldered to a base plate using four soldering bumps alloy of 400 μm diameter, with two bumps at each sides. In c 2 mm cube soldered to a base plate with two soldering bumps alloy of 760 μm diameter. Below, different sizes of manufactured FS cubes; biggest at the back row with 2 mm, in the middle row cubes manufactured with 1 mm and the smallest in the front row with 0.3 mm. In d, cubes and Aluminum Nitride (AIN) base-plates before metallization. In e, after components metallization with Ti/Pt/Au layers applied by physical vapor deposition