Fig. 4From: Solderjet bumping packaging technique optimization for the miniaturization of laser devicesDifferent sizes of manufactured and soldered FS cubes. In a, different soldered cube sizes (2 mm, 1 mm and 0.3 mm sides) soldered with different soldering alloy diameter sizes (760 μm, 400 μm and 300 μm). In b, different 2 mm cubes soldered with different amount and size of soldering bumpsBack to article page