Fig. 5
From: Solderjet bumping packaging technique optimization for the miniaturization of laser devices
In a minimum stress along laser beam path was obtained for the case of a 1 mm cube soldered with two 300 μm solderjet bumps. In b, similar soldered case was measured with a polarimeter. The amount of induced stress was not measurable with the polarimeter in (b) since it was much lower than the limit of resolution and sensitivity of the polarimeter device (<0.1 MPa). In c and d higher measurable stress on a 2 mm cube soldered with four 400 μm bumps; both simulated and real-measured cases show similar stress distribution, with an amount of less than 1 MPa induced stress close to the soldered areas