Fig. 7From: Solderjet bumping packaging technique optimization for the miniaturization of laser devicesAmplitude of the transmitted field behind the FS component, with Ey-polarized Gaussian at 1064 nm as the input. Column a ideal case without stress; column b with 0.2 × applied stress; c with actual solderjet bumping packaging induced stress; column d: with 5 × increased stress. Upper row corresponds to the Ey-component and lower row the Ex-componentBack to article page