From: Solderjet bumping packaging technique optimization for the miniaturization of laser devices
Laser cavity beam | Component condition |
---|---|
1. Gaussian @1064 nm emission, 50 μm waist radius, Ey-polarization | a. Ideal case: without stress b. Comparing case: with (0.2 ×) stress by design c. Real case: with actual applied stress d. Comparing case: with increased stress (5 ×) by design |