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Table 2 Studied laser produced beams and stress component conditions

From: Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Laser cavity beam

Component condition

1. Gaussian @1064 nm emission, 50 μm waist radius, Ey-polarization

a. Ideal case: without stress

b. Comparing case: with (0.2 ×) stress by design

c. Real case: with actual applied stress

d. Comparing case: with increased stress (5 ×) by design