Fig. 6From: Solderjet bumping packaging technique optimization for the miniaturization of laser devicesIn (a) example of 2 mm sided cube with the extracted set of homogeneous layers. In (b) homogeneous layers along the z-direction (laser beam path) expressed by the resulted stress in ANSYS \( {\boldsymbol{\upsigma}}_{\mathbf{kl}}^{\left(\mathbf{p}\right)} \) Back to article page