Table 1 Different studied cases of fused silica (FS). Crystal cube sizes with variations of soldering bumps
From: Solderjet bumping packaging technique optimization for the miniaturization of laser devices
Crystal size | ||||
|---|---|---|---|---|
FS 0.3 mm cube side | FS 1 mm cube side | FS 2 mm cube side | ||
Soldering preform size | 300 μm diameter | 2 bumps. 1 × side | 2 bumps. 1 × side | 4 bumps. 2 × side |
4 bumps. 2 × side | 6 bumps. 3 × side | |||
400 μm diameter | 2 bumps. 1 × side | 2 bumps. 1× side | 2 bumps. 1 × side | |
4 bumps. 2 × side | 4 bumps. 2 × side | |||
6 bumps. 3 × side | ||||
760 μm diameter | 2 bumps. 1 × side | 2 bumps. 1 × side | 2 bumps. 1 × side | |